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| Type CC Low Resistance Precision Chip Resistors Page 1 of 2 * Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pads to receive aluminum wire bonds. * Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina. * Resistance range down to 0.010 ohm at 5%, 0.050 ohm at 2%, and 0.10 ohm at 1%. * Low inductance provides excellent high frequency and pulse response. * High pulse handling and overload capability. * Best choice for switching power supplies, motor speed controls, and high current sensing applications. Style FC - Flip Chip Version is a surface mount version with solderable pads for flip chip soldering. Resistance Model Min. 0.010 0.020 0.020 0.010 0.025 Max. 0.015 10.0 10.0 0.020 10.0 Power Capability Information General Applications High Power Applications Thermal Resistance - RJC Power Rating Film (J) to Solder Pad (C) at 70 C (see note 2) (see note 1) Max. Chip Temperature Dimensions in inches and (millimeters) A .150 .007 (3.81 .18) .150 .007 (3.81 .18) .200 .007 (5.08 .18) .250 .007 (6.35 .18) .250 .007 (6.35 .18) B .120 .007 (3.05 .18) .120 .007 (3.05 .18) .150 .007 (3.81 .18) .200 .007 (5.08 .18) .200 .007 (5.08 .18) C .027 .005 (.69 .13) .022 .003 (.56 .08) .027 .003 (.69 .08) .032 .005 (.81 .13) .041 .004 (1.04 .10) D .035 min. (0.89 min.) .035 min. (0.89 min.) .050 min. (1.27 min.) .065 min. (1.66 min.) .040 min. (1.02 min.) Comments CC1512FC CC2015FC CC2520FC 0.75 Watt 0.75 Watt 1.0 Watt 1.5 Watts 1.5 Watts 22.7C/Watt 22.7C/Watt 16.0C/Watt 13.0C/Watt 11.5C/Watt 150C 150C 150C 150C 150C Solder Coated Pads Solderable Pads Solderable Pads Solder Coated Pads Solderable Pads Style FC Derating Curve For General Applications 100 RATED LOAD, % CC1512FC Standard Resistance Values: Tolerance CC1512FC 1% Standard (except as noted). 5% 5% 5% 5% 5% 0.033 0.040 0.050 0.075 0.10 0.15 5% 5% 2% 2% 0.20 0.25 0.30 0.33 0.40 0.50 0.75 1.00 1.50 2.00 2.50 3.00 3.30 4.00 5.00 7.50 8.00 10.0 0.010 0.015 0.020 0.025 0.030 80 60 40 20 0 25 70 100 150 AMBIENT TEMPERATURE, o C Note 1: General Applications - The power rating for general applications is based upon 0.5 sq. in. (300 mm2) of termination pad or trace area (2 oz. copper) connected to each end of the resistor. Maximum chip temperature is 150C. Use Derating Curve to derate appropriately for the maximum ambient temperature and for the temperature limitations of the adjacent materials. CC2015FC Standard Resistance Values: 0.020 5% 0.025 5% 0.030 5% 0.033 0.040 0.050 0.075 0.10 0.15 5% 5% 2% 2% 0.20 0.25 0.30 0.33 0.40 0.50 0.75 1.00 1.50 2.00 2.50 3.00 3.30 4.00 5.00 7.50 8.00 10.0 Tolerance CC2015FC 1% Standard (except as noted). Note 2: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and the solder pad temperature is measured at the center of the termination pad (point X in the recommended circuit layouts shown below). Maximum temperature of the chip resistor (at the center of chip) should not exceed 150C through the temperature range of the application. CC2520FC Standard Resistance Values: 0.010 0.015 0.020 0.025 0.030 5% 5% 5% 5% 5% 0.033 0.040 0.050 0.075 0.10 0.15 5% 5% 2% 2% 0.20 0.25 0.30 0.33 0.40 0.50 0.75 1.00 1.50 2.00 2.50 3.00 3.30 4.00 5.00 7.50 8.00 10.0 Tolerance CC2520FC 1% Standard (except as noted). Recommended Circuit Board Layout (current and sense connections): Fig. 1A: Kelvin layout recommended for values below 0.20 C = Current connection S = Sense connection C C Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering. X S S X Fig. 1B: Kelvin layout recommended for higher resistance values. C X X C C S S Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown. Applications Engineering 17271 North Umpqua Hwy. Roseburg, Oregon 97470-9422 Phone: (541) 496-0700 Fax: (541) 496-0408 (c) 2004 Caddock Electronics, Inc. CADDOCK e-mail: caddock@caddock.com * web: www.caddock.com For Caddock Distributors listed by country see caddock.com/contact/dist.html Sales and Corporate Office 1717 Chicago Avenue Riverside, California 92507-2364 Phone: (951) 788-1700 Fax: (951) 369-1151 28_IL106.1004 Type CC Low Resistance Precision Chip Resistors Page 2 of 2 Style WB - Wire Bond Version Resistance Model CC2015WB CC2520WB is a hybrid mountable version with metallized pads for wire bonding utilizing aluminum wire and a metallized back surface for solder attachment of the back surface to a heat sinking substrate. Dimensions in inches and (millimeters) A .200 .007 (5.08 .18) .250 .007 (6.35 .18) B .150 .007 (3.81 .18) .200 .007 (5.08 .18) C .027 .003 (.69 .08) .027 .003 (.69 .08) D .050 min. (1.27 min.) .040 min. (1.02 min.) Aluminum wire to be used for bonding Aluminum wire to be used for bonding Power Capability Information Thermal Resistance RJC Film (J) to Solder Pad (C) (see note 3) 13.9C/Watt 8.33C/Watt Max. Chip Temperature Comments Min. 0.020 0.025 Max. 10.0 10.0 150C 150C Note 3: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and the solder pad temperature is measured at the soldered interface with the circuit board. Maximum temperature of the chip resistor (at the center of chip) should not exceed 150C through the temperature range of the application. CC2015WB Standard Resistance Values: Tolerance CC2015WB 1% Standard (except as noted). 0.020 0.025 0.030 0.033 0.040 5% 5% 5% 5% 5% 0.050 2% 0.075 2% 0.10 0.15 0.20 0.25 0.30 0.33 0.40 0.50 0.75 1.00 1.50 2.00 2.50 3.00 3.30 4.00 5.00 7.50 8.00 10.0 Location for Sense (Potential) Connection: Sense connection shall be made in the crosshatched portion of the termination pad. Film Temperature Measuring Point Sense Wire Current Wire CC2520WB Standard Resistance Values: 0.025 0.030 0.033 0.040 5% 5% 5% 5% 0.050 2% 0.075 2% 0.10 0.15 0.20 0.25 0.30 0.33 0.40 0.50 0.75 1.00 1.50 2.00 2.50 3.00 3.30 4.00 5.00 7.50 8.00 10.0 Tolerance CC2520WB 1% Standard (except as noted). Sense Wire Current Wire Solder pad, soldered interface with circuit board. .055 (1.40) centered Circuit board: IMS, Ceramic (Alumina) , or other. WB Resistor mounting Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering. General Information for Type CC - Style FC and Style WB - Chip Resistors Specifications: Temperature Coefficient: TC referenced to +25C, R taken at +150C. 0.50 ohm and above, -20 to +80 ppm/C 0.050 ohm to 0.49 ohm, 0 to +200 ppm/C below 0.050 ohm, 0 to +300 ppm/C. Inductance: Less than 5 nH typical. Load Life: 1000 hours at rated power, based upon 150C max. chip temperature, R (0.5% + 0.0005 ohm). Momentary Overload: 1.5 times rated power, for 5 seconds, R (0.5% + 0.0005 ohm). Operating Temperature: -55C to +150C. Measurement Note: All measurements are taken using Kelvin connections per the recommended connection locations. Solder attachment note: Style FC has a bare ceramic back surface. The recommended solders for flip chip solder attachment are 62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu solder alloys. Style WB has a metallized back surface for soldering to a substrate or a heat sink. The recommended solders to be used are 62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu solder alloys. Packaging information: Style FC, flip chip resistors, are shipped with the bare ceramic side up in the pocket, with the solderable pads facing down. Style WB, wire bondable resistors, are shipped with the wire bondable pads facing up in the pocket. The illustration shows the orientation of the CC1512 and CC2015 chip resistors in the tape. The CC2520 chip resistors are rotated 90 from what is shown in the illustration. 7" dia. (178 mm) 12mm 0.473" Bo Ao Ordering Information: Ko signifies tape thickness and dimension Physical Size 1512 = 0.150" x 0.120" 2015 = 0.200" x 0.150" 2520 = 0.250" x 0.200" Ao Bo Ko .512" arbor hole (13mm) Size 1512 Size 2015 Size 2520 CC 2520 FC - 0.10 - 1% Type CC Style: FC or WB Resistor Value () See charts for availability Tolerance: 5% below 0.050 2% 0.050 to 0.099 1% 0.10 and above 0.135" (3.43mm) 0.189" (4.80mm) 0.271" (6.88mm) 0.167" (4.24mm) 0.209" (5.31mm) 0.216" (5.49mm) 0.037" (0.94mm) 0.087" (2.21mm) 0.066" (1.68mm) A D C B Carrier Tape and pocket dimensions: Tape is 12mm Carrier Tape (8mm pitch) Full reel quantities: 1500 pieces per reel for CC1512 1000 pieces per reel for CC2015 and CC2520 Quantities of less than 250 will be shipped in tape without reel and without tape leader at the option of Caddock. Tape dimensions and materials will be consistent with EIA-481-1. Reels will be marked with a label containing Caddock logo, part number, resistor value, tolerance, packaging date, and quantity. Dimensions in inches and (millimeters) Applications Engineering 17271 North Umpqua Hwy. Roseburg, Oregon 97470-9422 Phone: (541) 496-0700 Fax: (541) 496-0408 (c) 2004 Caddock Electronics, Inc. CADDOCK e-mail: caddock@caddock.com * web: www.caddock.com For Caddock Distributors listed by country see caddock.com/contact/dist.html Sales and Corporate Office 1717 Chicago Avenue Riverside, California 92507-2364 Phone: (951) 788-1700 Fax: (951) 369-1151 28_IL106.1004 |
Price & Availability of CC2015FC
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